Samsung is considering a number of different heat pipe shapes and styles for Galaxy S7, though it should have a final decision by the end of the year. We just hope this doesn’t end up delaying the Galaxy S7 from its expected launch in early 2016, according to technobuffalo.com.
Photo Source: www.forbes.com
Respected newspaper The Korea Times reports that with the Galaxy S7, Samsung plans to make minimal changes to the most controversial aspect of the Galaxy S6: its design.
“As the S6 and S6 Edge represented progress, the S7 will have improvements both in picture quality, performance and other some new features. But because smartphones have already been commoditized, you don’t need to spend more on a surface overhaul,” said The Korea Times’ source. “The key point is can consumers enjoy content with enhanced viewing quality and boosted processing speed.”
Samsung is expected to unveil the Galaxy S7 in just a few months, but the company may be scrambling to solve a pretty big problem with the rumored flagship phone. A new report out of China claims the South Korean giant may need to include add a heat pipe to its internal design to avoid possible overheating issues.
Photo Source: androidpit.com
The report notes that Samsung is still considering a number of different heat pipe shapes and styles, though it should have a final decision by the end of the year. We just hope this doesn’t end up delaying the Galaxy S7 from its expected launch in early 2016.
According to unofficial information, the Samsung Galaxy S7 will come in two versions: one based on the Exynos 8890 chipset and one based on the Qualcomm Snapdragon 820. At this point, it should be mentioned that all smartphone chips throttle performance when dangerous temperature levels are reached and that a more effective heat dissipation system is likely to improve the overall performance of any mobile SoC.